Our surface-mount lines run multi-head placement, fine-pitch BGA, and lead-free reflow soldering — engineered for 0201 components and ±25µm placement accuracy on every run.
Our SMT lines combine multi-head pick-and-place, closed-loop solder paste inspection, and nitrogen-inert reflow to hold tight tolerances across 0201 passives and fine-pitch BGAs — without sacrificing throughput on high-mix production.
Multi-head placement machines rated for 0201 passives and fine-pitch components at production speed.
0.4mm pitch BGA and QFN placement with vision-guided alignment for zero-defect solder joints.
3D SPI on every board post-print, catching insufficient or excess paste before components are placed.
SAC305 RoHS-compliant reflow with precision thermal profiling tuned per board stack-up.
Nitrogen reflow reduces oxidation for cleaner, more reliable solder joints on dense boards.
100% automated optical inspection scanning for tombstoning, bridging, and placement drift.
Our lines are qualified for 0201 (0.6×0.3mm) passives and fine-pitch BGAs down to 0.4mm ball pitch.
Yes, nitrogen-inert reflow is standard on our lines and is particularly recommended for dense, multi-layer boards or lead-free processes.
Yes — we regularly run mixed-technology boards, sequencing SMT placement first followed by THT insertion and wave or selective soldering.
Every board passes through solder paste inspection pre-reflow and automated optical inspection post-reflow before moving to the next process step.
Send your Gerbers and component list and we'll confirm placement feasibility, tooling needs, and lead time — usually within 24 hours.
Gut No. 196, Plot No.4, Nandur-Vaidya Road, Wadivarhe, Nashik — 422 403
From 0201 passives to fine-pitch BGAs, our SMT lines are built to hold tolerance at production speed. Send your design and we'll confirm feasibility fast.