Network and data-centre hardware pushes high pin-count connectors, dense multi-layer boards, and demanding signal integrity requirements. We assemble to those tolerances, at the volumes network OEMs need.
Multi-layer boards for network switching and routing hardware with high pin-density connectors.
RF and baseband boards for telecom base station and network infrastructure hardware.
Server and networking appliance boards built for density and thermal performance.
Assembly support for boards up to 32 layers, common in networking and telecom designs.
Precision placement for high pin-count BGAs and board-to-board connectors used in network gear.
Embedded firmware and functional test support for connected network hardware.
Yes, our design and assembly processes support boards up to 32 layers, which covers most networking and telecom designs.
Yes, our SMT lines are qualified for 0.4mm pitch BGA placement with vision-guided alignment.
Yes, our Software Support service covers embedded firmware and testing frameworks alongside the hardware build.
From prototype validation batches up to 100,000+ boards per run on the same qualified lines.
Tell us your layer count, connector types, and expected volume, and we'll confirm feasibility and a realistic lead time.
Gut No. 196, Plot No.4, Nandur-Vaidya Road, Wadivarhe, Nashik — 422 403
From switches to base station boards, we assemble network hardware to the density and tolerance this industry demands. Let's talk.