Our Infrastructure

A glimpse of our manufacturing facility

Pick & Place Machine

  • 23500 CPH chip (Laser centering/Optimum).
  • From 0603 to 33.5mmsquare components
    JUKI laser centering for high speed, high accuracy placement.
  • Improved placement quality
  • Alternate pick by screw-type nozzles* achieves high-speed placement for large component up to 25 mm diameter.
  • High-precision placement of diffusion lenses
    Capable of up to 1,500 mm long board
    production, top class board size in industry.
    Various supply methods 
  • Auto fiducial sensing, High Resolution Camera

Solder Paste Screen Printer

  • PLC controlled with touch screen monitor.
  • Universal jig for double side PCB printing. 
  • X, Y, θ manual control. 
  • Z Axis Servo Control. 
  • AC servo controlled PCB – Stencil snap off. 
  • Snap off distance & speed programmable. 
  • Settable squeegee motor speed from 10-72.5 mm / sec. 
  • Dual squeegee head with controllable squeegee pressure. 
  • Dual camera option with monitor for PCB – Stencil alignment. 
  • PCB Table up-down AC Servo Controller. 
  • Can accommodate max. size of 300X300 mm PCBs. 
  • Programmable, height and speed adjustment

Multi Zone Reflow Oven

  • 8 Heating Zones
  • Computer Control System, make sure machine working steadily.

  • Both top and bottom zones Hot Air Heating System, good heater compensatory, High thermal efficiency, energy saving, speedy heating, suitable for soldering components like BGA,CSP etc. Special forced hot air circulation structure makes PCB and components heat evenly, Temperature Accuracy ± 1.5 °C, room temperature settling time less than 20 minutes.

  • Cooling System : Independent cooling area ensures the low temperature when PCB comes out.

  • Transmission system :  Use imported motors, speed adjuster, smoothly running, adjustable speed at 0-2000mm/min.

Automatic Wave Soldering Machine

  • Tabletop model, Floor standing model
  • Microcontroller based design
  • Lcd display, set and actual values display at the same time
  • Lead-free and non-lead-free solder pot options
  • Single wave and smd wave options.
  • Inbuilt flux air pump
  • Auto on-off of flux and solder wave
  • Slide-out foam fluxer with drip tray
  • Foam fluxer std and spray fluxer option in bigger machine
  • Status light tower
  • 180 kg solder tank.
  • Maximum PCB size 300 X 300 mm.

Our Design Infrastructure:

  • Experienced hardware design engineers in multiple domains.
  • Experienced software / firmware engineers.
  • Well-equipped testing facilities.
  • Design Tools and Schematic Simulators
  • Design Library
  • Industrial Standards